[1]曾海,郭震宁,陈俄振,等.矩形基板上LED芯片阵列热分析[J].华侨大学学报(自然科学版),2013,34(3):267-273.[doi:10.11830/ISSN.1000-5013.2013.03.0267]
　ZENG Hai,GUO Zhen-ning,CHEN E-zhen,et al.Thermal Analysis of LED Chip Array on Rectangular Substrate[J].Journal of Huaqiao University(Natural Science),2013,34(3):267-273.[doi:10.11830/ISSN.1000-5013.2013.03.0267]
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矩形基板上LED芯片阵列热分析()
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《华侨大学学报（自然科学版）》[ISSN:1000-5013/CN:35-1079/N]

卷:
第34卷
期数:
2013年第3期
页码:
267-273
栏目:
出版日期:
2013-05-20

文章信息/Info

Title:
Thermal Analysis of LED Chip Array on Rectangular Substrate
文章编号:
1000-5013(2013)03-0267-07
作者:
曾海;  郭震宁;  陈俄振;  胡治伟
华侨大学 信息科学与工程学院, 福建 厦门 361021
Author(s):
ZENG Hai;  GUO Zhen-ning;  CHEN E-zhen;  HU Zhi-wei
College of Information Science and Engineering, Huaqiao University, Xiamen 361021, China
关键词:
发光二极管;  阵列芯片;  多芯片封装;  过余温度
Keywords:
light emitting diodel;  array chips;  multi-chip package;  excess temperature
分类号:
O472.3
DOI:
10.11830/ISSN.1000-5013.2013.03.0267
文献标志码:
A
摘要:
分析偏心热源在矩形基板上热分布理论,利用局部模拟和理论论证的方法,获得m’×n’阵列中各芯片的质心温度一致的排布.利用这种排布方法,得出能求解芯片质心过余温度(CTEC)的简单关系式.同时,模拟了4×4, 6×6阵列芯片的过余温度分布的情况.结果表明:m’×n’阵列中LED芯片以芯片间距(a/m’,b/n’)在尺寸为a×b的矩形基板上对称排布时,各芯片的 CTEC都相同.
Abstract:
The heat distribution theory of the eccentric heat source in the rectangular was analyzed. Using the means of portion simulations and theoretical argument, the arrangement of m’× n’ array chips with identical centroid temperature in each chip was obtained. Using this arrangement a simple equation was obtained which could solve the centroidal temperature excess of chips(CTEC). Meanwhile, 4×4 and 6×6 array chip of centroidal temperature excess were simulated. These results showed that: m’×n’ array LED chip to chip spacing(a/m’, b/n’)symmetrical arrangement on rectangular substrate of size a×b, each chip has equal CTEC.

参考文献/References:

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备注/Memo

备注/Memo:
收稿日期: 2012-04-23
通信作者: 郭震宁(1958-),男,教授,主要从事光电材料与器件的研究.E-mail:znguo2003@yahoo.com.
基金项目: 福建省科技计划重点基金资助项目(2009H0034); 福建省自然科学基金资助项目(2010J01338); 福建省发改委发明创造扶持基金资助项目(FC200905)
更新日期/Last Update: 2013-05-20