[1]乐其河,江开勇.活性添加剂分散调控对镀铜线精细化的影响[J].华侨大学学报(自然科学版),2025,46(4):379-385.[doi:10.11830/ISSN.1000-5013.202504038]
　LE Qihe,JIANG Kaiyong.Influence of Dispersion Control of Active Additives on Refinement of Copper Plated Wire[J].Journal of Huaqiao University(Natural Science),2025,46(4):379-385.[doi:10.11830/ISSN.1000-5013.202504038]
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活性添加剂分散调控对镀铜线精细化的影响()
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《华侨大学学报（自然科学版）》[ISSN:1000-5013/CN:35-1079/N]

卷:
第46卷
期数:
2025年第4期
页码:
379-385
栏目:
出版日期:
2025-07-16

文章信息/Info

Title:
Influence of Dispersion Control of Active Additives on Refinement of Copper Plated Wire
文章编号:
1000-5013(2025)04-0379-07
作者:
乐其河;  江开勇
华侨大学 福建省特种能场制造重点实验室, 福建 厦门 361021
Author(s):
LE Qihe;  JIANG Kaiyong
Fujian Key Laboratory of Special Energy Manufacturing, Huaqiao University, Xiamen 361021, China
关键词:
电解加工;  激光活化;  化学镀铜;  线条精细化;  颗粒分散性
Keywords:
electrochemical machining;  laser activation;  electroless plating copper;  refinement;  particle dispersibility
分类号:
TQ153.14
DOI:
10.11830/ISSN.1000-5013.202504038
文献标志码:
A
摘要:
针对柔性阴极电解加工中镀铜线条边缘精细化问题,研究添加剂颗粒粒度及分散性对镀铜质量的影响。调整添加剂颗粒的研磨时间与浆料搅拌方式,并结合激光活化及化学镀铜工艺,制备导电线路并分析其形貌。结果表明:添加剂颗粒的研磨时间对其粒度有显著影响,经48 h研磨的颗粒粒度稳定在1.445 μm,分散性提升,团聚减少;采用高速分散机搅拌5 min后聚氨酯中的颗粒面积分数较传统搅拌降低了11.9%;添加剂颗粒细化与均匀分散改善了激光活化催化中心的均匀性,当研磨时间达48 h、搅拌时间为5 min时,镀铜线条边缘整齐清晰,线条分布均匀,线宽约为85.1 μm。
Abstract:
To address the issue of edge refinement of copper plated wires in flexible cathode electrochemical machining, the influence of additive particle size and dispersion on copper plating quality was studied. The grinding time of additive particles and the slurry stirring method were adjusted, and laser activation was combined with electroless copper plating processes to prepare conductive wires and their morphology was analyzed. The results demonstrated that grinding time significantly influenced the particle size, which stabilized at 1.445 μm after 48 hours of grinding, with improved dispersibility and reduced agglomeration. After stirring for 5 minutes using a high-speed disperser, the particle area fraction in polyurethane decreased by 11.9% compared to traditional stirring. The refinement and uniformly dispersed additive particles improved the uniformity of laser activated catalytic centers. Under the optimal conditions(48 hours grinding and 5 minutes high-speed stirring), the copper plated wires exhibited sharp and well-defined edges, uniform distribution, and a consistent wire width of approximately 85.1 μm.

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备注/Memo

备注/Memo:
收稿日期: 2025-04-22
通信作者: 乐其河(1991-),男,实验师,主要从事特种加工的研究。E-mail:leqihe@hqu.edu.cn。
基金项目: 国家自然科学基金资助项目(51475174)
更新日期/Last Update: 2025-07-20